• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    SMALL SIZE, WEIGHT, AND IMAGE SENSOR PACKAGING. A method and structure of an image sensor device comprising a readout integrated circuit (ROIC) and a photodiode array (PDA). One embodiment may include a housing substrate having a recess and a raised pedestal within the recess; a readout integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to and electrically coupled to the ROIC; and a printed circuit board (PCB) within the recess in the housing substrate, wherein the PCB has an opening therein and the raised pedestal extends at least partially through the opening in the PCB.
    公开号:BE1021228B1
    申请号:E2014/0285
    申请日:2014-04-23
    公开日:2015-08-18
    发明作者:John Tagle；Dmitry Zhlinsky；Jr Michael A. Liland
    申请人:Sensors Unlimited, Inc.；
    IPC主号:
    专利说明:

    SMALL SIZE, WEIGHT, AND PICTURE SENSOR PACKAGING
    REFERRAL TO ASSOCIATED APPLICATIONS
    This application claims the benefit of US Provisional Application No. 61/815192, filed April 23, 2013, the entire contents of which is hereby incorporated by reference.
    FIELD OF THE INVENTION
    The present teachings relate to the field of integrated circuits and, more particularly, the packaging for a focal plane matrix device comprising a photodiode array and an integrated readout circuit.
    HISTORY OF THE INVENTION
    Light-sensitive image sensors such as focal plane array (FPA) devices include a photodiode array (PDA) packaged with an integrated readout circuit (ROIC). Many different FPA package configurations are available, including, for example, wired or wireless enclosures. Each type of conventional housing for FPA can include various common features.
    Figure 6 shows a schematic cross section of an FPA 200 device packaged as a wireless chip carrier (LCC). FIG. 6 comprises a support body 202 made of ceramic, plastic, or resin comprising internal traces 204 electrically coupled to external studs or slots 206. The external studs 206 may be surface-mounted on a card. circuit using a conductor, or the device 200 may be placed in an LCC socket Figure 6 further depicts a ROIC 208 physically attached to the carrier 202 using an adhesive 210. Connecting wires 212 electrically coupled to connection pads (not shown individually for simplicity) on the ROIC 208 to the traces 204 in the support body 202 so that the circuits on the ROIC 208 are electrically accessible via the external pads 206. A PDA 214 is mounted on the top surface of the ROIC 208 using a non-conductive adhesive (not shown individually for simplicity). The casing 216 is hermetically sealed to the support 202 and includes a transparent window 216A that exposes the PDA 214 to the outside light. In the device 200 of FIG. 6, the support 202 is configured so that the lower surface of the cover 216 does not communicate with the loop in the connection wires 212, 218. FPAs including ROICs and PDAs provided in the different case styles are well known.
    Design goals for semiconductor device engineers include the provision of devices having smaller dimensions and weight, reduced cost, and improved reliability. A device design that would contribute to one or more of these objectives would be desirable.
    SUMMARY OF THE INVENTION
    The following is a simplified summary to provide a basic understanding of some aspects of one or more embodiments of the following teachings. This summary is not an overview, it is neither intended to identify the key or critical elements of the present teachings, nor to delimit the scope of the invention. On the contrary, its main purpose is simply to present one or more concepts in a simplified way as a prelude to the detailed description presented later.
    In one embodiment, an image sensor may include a housing substrate including a recess and a raised pedestal within the recess, an integrated reading circuit (ROIC) physically attached to the raised pedestal, a photodiode array (PDA). physically attached to and electrically coupled to the ROIC, and a printed circuit board (PCB) within the recess in the housing substrate, wherein the PCB has an opening therein and the raised pedestal extends at least partially through the opening in the ICC.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include a metal case substrate.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include an encapsulation layer that seals the environment of a surface of the PCB within the housing substrate. .
    In addition to one or more of the features described above, or as an alternative, other embodiments may include an electrical connector electrically coupled to the PCB, wherein the electrical connector extends from the circuit board to through the encapsulation layer to provide an electrical connection of the outer casing to the CCI.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include an encapsulation layer that is formed on a first side of the housing substrate and the device further comprises a an electrical connector electrically coupled to the PCB and extending from a second side of the housing substrate that is opposed to the first side to provide an electrical connection of the outer casing to the PCB.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include an optically transparent window attached to the PDA, wherein the encapsulation layer is physically in contact with the window optically. transparent.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include a plurality of lead wires that electrically couples the CCI to the ROIC.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include a PDA that is flipped to ROIC and the plurality of connection wires are electrically coupled to the PDA at the same time. through the ROIC.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include that the ROIC, PDA, and CCI are received within the recess in the housing substrate in their entirety. .
    In addition to one or more of the features described above, or as an alternative, other embodiments may include an ICC that surrounds the ROIC and the 360-degree PDA.
    In another embodiment, a method of forming an image sensor may include attaching a printed circuit board (PCB) within a recess in a substrate of the housing so that a pedestal elevated to the within the recess of the housing substrate extends at least partially through an opening in the CCI, attaching an integrated reading circuit (ROIC) to the raised pedestal of the housing substrate, attaching a photodiode array (PDA) to the ROIC , wherein the PDA is electrically coupled to the ROIC, and electrically coupling the ROIC to the ICC.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include fixing the PCB within the recess of the housing substrate that attaches the PCB to a metal housing substrate. .
    In addition to one or more of the features described above, or as an alternative, other embodiments may include dispensing an encapsulation layer within the recess in the housing substrate to seal the environment. a surface of the CCI within the housing substrate. r
    In addition to one or more of the features described above, or as an alternative, other embodiments may include physically contacting an electrical connector with the encapsulation layer during distribution of the encapsulation wherein, as a result of the distribution of the encapsulation layer, the electrical connector extends through the encapsulation layer to provide an electrical connection of the outer casing to the CCI.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include distributing the encapsulation layer on a first side of the housing substrate such that an electrical connector extends from a second side of the housing substrate that is opposite to the first side and the electrical connector provides an electrical connection of the outer housing to the CCI.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include attaching an optically transparent window to a surface of the PDA, wherein the distribution of the encapsulation physically contacts the optically transparent window with the encapsulation layer.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include electrical coupling of the ICC to the ROIC using a plurality of connection wires.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include flip-flipping the PDA to the ROIC and the electrical coupling of the CCI to the ROIC using the plurality of connecting wires that electrically couple the CCI to the PDA.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include placing the ROIC, PDA and CCI in their integrals within the recess in the housing substrate.
    In addition to one or more of the features described above, or as an alternative, other embodiments may include after the CCI attachment within the recess in the housing substrate, the ROIC at the raised pedestal of the housing. housing substrate, and the PDA at ROIC, the ICC surrounds the ROIC and the 360-degree PDA.
    BRIEF DESCRIPTION OF THE DRAWINGS
    The accompanying drawings, which are incorporated herein and constitute a part of this specification, illustrate embodiments of the present teachings and together with the description serve to explain the principles of the invention. In the figures:
    Figure Ί is a perspective view of a substrate such as a metal substrate according to an embodiment of the present teachings;
    Figure 2 is a perspective view of a window printed circuit board in accordance with an embodiment of the present teachings;
    Figure 3 is a perspective view of an image sensor assembly according to an embodiment of the present teachings;
    Figure 4 is a cross-sectional view of the assembly of Figure 3;
    Figure 5 is a perspective representation of the assembly of the image sensor of Figure 3 after an encapsulation process; and
    Figure 6 is a cross section showing a conventional focal plane array.
    It should be noted that some of the details in the Figures have been simplified and are illustrated to facilitate understanding of the present teachings rather than to preserve strict structural precision, detail and scale.
    DETAILED DESCRIPTION OF THE INVENTION
    Reference will now be made in detail to the exemplary embodiments of the present teachings, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers will be used throughout the drawings to refer to the same or similar parts.
    Achieving reliable electrical connections in a conventional device package becomes more difficult with the reduction of device dimensions. A device such as that shown in Figure 6 includes many different material interfaces that can have a negative effect on the assembly and operation of the device. There is a constant desire of the electronics industry to reduce the size, weight and energy of the devices. The packaging of the optoelectronic devices, such as that shown in Figure 6, can be limited by three factors, including the tracing of electrical signals, the transfer of optical signals and the dissipation of heat. This packaging methodology, however, creates multiple electrical, optical and thermal interfaces that can drive into a relatively large, heavy device with less efficient energy operation.
    One embodiment of the present teachings may result in a device having reduced size, weight and improved packaging compared to some conventional devices. While an embodiment of the present teachings is described below with reference to Figures 1-4, it will be understood that various modifications of the illustrated design are contemplated.
    Figure 1 shows a device housing substrate 10 that can be machined or molded. The substrate of the housing 10 may be a conductor, either in part or in its entirety, for example a metal such as aluminum, or a dielectric, for example a ceramic or a polymer. If formed from a metal, the housing substrate 10 may function more efficiently as a heat sink for the assembled internal device electronics as described below. The housing substrate 10 may comprise a recess 12 and a raised pedestal 14. The size of the pedestal 14 may be smaller than, or about the same size as, an integrated reading circuit (ROIC) which will be attached thereto as described below. The housing substrate 10 may also include holes 16, such as threaded holes, to facilitate the connection of a printed circuit board (PCB) as described below, despite other mechanical connection and connection techniques. chemicals, eg adhesives, are also contemplated. The housing substrate 10 may also include one or more holes 18 measured to receive an electrical connector as described below.
    The contour of the recess 12 of the housing substrate 10 is measured to receive a biological or ceramic material CCI 20, such as that shown in Figure 2. The CCI 20 includes an opening therethrough 22, which is measured to accommodate a ROIC. as described below. CCI 20 includes circuitry 24 thereon. Circuitry circuit design 24 may be generally known in the art for the operation of a focal plane array (FPA) device which comprises a photodiode array (PDA) and a ROIC.
    The CCI 20 may either comprise a first electrical connector 26 on an upper surface 28 of the PCB 20, a second electrical connector 30 on a lower surface 32 of the PCB 20 which extends through the hole 18, being both a first electrical connector 26 and a second electrical connector 30. The electrical connectors 26, 30 will transmit power, mass and operational signals between the complete device and the apparatus in which the complete device is installed. The PCB 20 may further comprise through holes 34 to facilitate the connection to the substrate of the housing 10.
    Figure 3 is a perspective view, and Figure 4 is a cross section showing CCI 20 after connection to the housing substrate 10 using a connection technique 40 such as screws or other connection technique. Figures 3 and 4 further show a ROIC 42 attached to the pedestal 14, for example using a dielectric adhesive 44 (Figure 4), and a PDA 46 attached to the ROIC 42. The PDA 46 can be flipped back to the ROIC 42 so that the circuitry on the PDA 46 is electrically coupled to the circuitry on the ROIC 42 using, for example, ball matrix (BGA) connections (not shown for simplicity) interposed between the PDA 46 and the ROIC 42. The device of Figures 3 and 4 may also include an optically transparent window or cover 48 attached to the upper surface of the PDA 46 using, for example, a glass frit or other optically clear adhesive. As shown in FIGS. 3 and 4, in this embodiment the CCI 20, the ROIC 42, and the PDA 46 are received within the recess 12 in the package body 10 in their entirety, although other modes implementation are envisaged.
    The circuitry on the top surface of the ROIC 42 may be electrically coupled to the PCB 20 using, for example, connection wires 50. The connection wires 50 may also electrically couple the PDA circuitry 46 to the circuitry on the CCI at through the circuitry on the ROIC 42.
    Thus in the embodiment shown, the top and bottom surfaces of the ROIC 42 and the upper and lower surfaces of the PDA 46 are each at a lower level than an upper surface of the housing substrate 10. After attachment to the PDA 46, an upper surface of the window 48 may be about the same level as the upper surface of the housing substrate 10. In other embodiments, the upper surface of the window 48 may be lower or higher than a top surface. In addition, the ICC 20 may surround both the ROIC 42 and the 360-degree PDA 46 as shown in FIG. 3, although the ICC 20 has been designed to partially surround the ROIC 42 and the PDA 46. The assembly of the device of Figure 3 can be realized in any feasible order. In one embodiment, the PCB 20 may be attached to the housing substrate 10 prior to or attachment of the ROIC 42 to the pedestal 14, or thereafter. The PDA 46 can be attached to the ROIC 42 before attaching the ROIC 42 to the pedestal 14, or thereafter. At this point during assembly, the device of Figures 3 and 4 can be electrically tested to ensure functionality. If the device fails, it can be easily dismantled and reworked to replace failed components.
    After completion of the device of Figures 3 and 4, the device may be encapsulated by dispensing encapsulation material within the remainder of the recess to fill the remainder of the recess 12 with a dielectric encapsulation layer, such as a dielectric layer. encapsulation of resin 52 as shown in FIG. 5. The encapsulation layer may seal at least one surface of the CCI 20, ROIC 42, and the PDA 46 from the environmental point of view within the substrate of the housing 10. The encapsulation layer 52 can physically contact the window 48.
    After completing the device as shown in FIG. 5, an electrical connection of the outer casing to the electronics of the internal device such as PDA 46, ROIC 42, and CCI 20 can be performed using either the first connector 26, the second connector 30, or both. As shown, the first connector 26 is electrically coupled to the PCB 20 and extends from a first surface of the device and through the encapsulation layer 52. The first connector 26 thus provides an electrical connection of the outer housing to the CCI 20. The device of Figure 5 may also include the second electrical connector 30 which is electrically coupled to the PCB 20 and extends from a second surface which is opposed to the first surface of the device. The second electrical connector 30 thus provides an electrical connection of the outer casing to the CCI 20. A device may either comprise a connector 26 or an electrical connector 30, or both.
    Notwithstanding the fact that the ranges and numerical parameters of the broad scope of the present teachings are approximations, the numerical values established in the specific examples are presented as precisely as possible. Any numerical value, however, inherently contains some errors necessarily resulting from the standard deviation found in their respective control measures. In addition, all ranges disclosed herein should be understood to encompass any and all sub-ranges summarized herein. For example, a range of "less than 10" can include any and all sub-ranges between (and including) the minimum value of zero and the maximum value of 10, i.e. all sub-ranges having a minimum value equal to or greater than zero and a maximum value equal to or less than 10, for example, from 1 to 5. In some cases, numerical values as indicated for the parameter may take negative values. In this case, the exemplary value of the range declared at "less than 10" may assume negative values, for example, -1, -2, -3, -10, -20, -30, and so on.
    Although the teachings have been illustrated with respect to one or more implementations, alterations and / or modifications may be made to the illustrated examples without departing from the spirit and scope of the appended claims. For example, it will be appreciated that although the process is described as a series of acts or events, the teachings are not limited by the order of the acts or events. Some acts may occur in different orders and / or simultaneously with other acts or events outside of those described here. Also, not all process steps may be necessary to implement a methodology in accordance with one or more aspects or embodiments of the present teachings. It will be appreciated that structural components and / or processing steps can be added or that existing structural components and / or processing steps can be removed or modified. In addition, one or more of the acts described herein may be performed in one or more distinct acts and / or phases. Furthermore, to the extent that the terms "including", "includes", "having", "a", "with", or variants thereof are used in either the detailed description and the claims, such terms are intended to be inclusive in a manner similar to the term "comprising". The term "at least one of" is used to designate one or more of the enumerable items that can be selected. In addition, in the discussion and claims here, the term "to" used with respect to two materials, "to" each other, means at least some contact between the materials, while "on" means that the materials are nearby, but perhaps with one or more additional intermediate materials so that contact is possible, but not mandatory. Neither "to" nor "on" implies any directivity as used herein. The term "compliant" describes a coating material in which the angles of the underlying material are retained by the compliant material. The term "about" indicates that the value indicated may be somewhat modified, as long as the change does not result in the non-compliance of the process or structure of the illustrated embodiment. Finally, "exemplary" indicates the description that is used as an example, rather than implies that it is an ideal. Other embodiments of the present teachings will be apparent to those skilled in the art of examining the specification and the practice of the present invention. It is intended that the specification and examples should be considered exemplary only, with real scope and the spirit of the present teachings being indicated by the following claims.
    Relative position terms as used in this application are defined based on a plane parallel to the conventional plane or working surface of a workpiece, regardless of the orientation of the workpiece. The term "horizontal" or "lateral" as used in this application is defined as a plane parallel to the conventional work surface or work surface of a workpiece, regardless of the orientation of the workpiece. The term "vertical" means a direction perpendicular to the horizontal. Terms such as "to", "side" (as in "sidewall"), "upper", "lower", "on", "high" and "below" are defined relative to the conventional plane or surface of work being on the upper surface of the workpiece, regardless of the orientation of the workpiece.
    权利要求:
    Claims (15)
    [1]
    An image sensor, comprising: a housing substrate comprising a recess and a pedestal elevated within the recess; an integrated reading circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to and electrically coupled to the ROIC; and a printed circuit board (PCB) within the recess in the housing substrate, wherein the PCB has an opening therein and the raised pedestal extends at least partially through the opening in the PCB.
    [2]
    The image sensor of claim 1, further comprising an encapsulation layer which seals the environment of a CCI surface within the substrate of the housing.
    [3]
    The image sensor of claim 2, further comprising an electrical connector electrically coupled to the PCB, wherein the electrical connector extends from the circuit board through the encapsulation layer to provide an electrical connection. from the outer casing to the CCI.
    [4]
    The image sensor of claim 2, wherein the encapsulation layer which is formed on a first side of the housing substrate and the device further comprises an electrical connector electrically coupled to the ICC and extending from a second side of the housing substrate which is opposite the first side to provide an electrical connection of the outer casing to the CCI.
    [5]
    The image sensor of claim 2, further comprising an optically transparent window attached to the PDA, wherein the encapsulation layer is in physical contact with the optically transparent window.
    [6]
    The image sensor of claim 1, further comprising a plurality of lead wires that electrically couples the CCI to the ROIC, wherein the PDA is hump-chip-connected to the ROIC and the plurality of lead wires are electrically coupled. to the PDA through the ROIC.
    [7]
    The image sensor of claim 1, wherein the ROIC, PDA and CCI are received within the recess in the housing substrate in their entirety.
    [8]
    A method of forming an image sensor, comprising: attaching a printed circuit board (PCB) within a recess in a housing substrate so that a pedestal elevated within the recess of the the housing substrate extends at least partially through an opening in the CCI; attaching an integrated reading circuit (ROIC) to the raised pedestal of the housing substrate; attaching a photodiode array (PDA) to the ROIC, wherein the PDA is electrically coupled to the ROIC; and the electrical coupling of the ROIC to the CCI.
    [9]
    The method of claim 8, further comprising dispensing an encapsulation layer within the recess in the housing substrate to seal the environment of a surface of the PCB within the housing substrate.
    [10]
    The method of claim 9, further comprising physically contacting an electrical connector with the encapsulation layer during distribution of the encapsulation layer in which, as a result of the encapsulation layer distribution, the electrical connector extends through the encapsulation layer to provide an electrical connection of the outer casing to the CCI.
    [11]
    The method of claim 9, further comprising distributing an encapsulation layer on a first side of the housing substrate so that an electrical connector extends from a second side of the housing substrate which is opposite the first side and the electrical connector provides an electrical connection of the outer casing to the CCI.
    [12]
    The method of claim 9, further comprising attaching an optically transparent window to a surface of the PDA, wherein the distribution of the encapsulation layer physically contacts the optically transparent window with the encapsulation layer.
    [13]
    The method of claim 8, further comprising: flip-flipping the PDA to the ROIC; and electrically coupling the CCI to the PDA using a plurality of connection wires for coupling the CCI to the ROIC.
    [14]
    The method of claim 8, further comprising placing the ROIC, the PDA, and the ICC in their integrals within the recess in the housing substrate.
    [15]
    The method of claim 14 wherein, after the CCI attachment within the recess in the housing substrate, the ROIC at the raised pedestal of the housing substrate and the PDA at the ROIC, the ICC surrounds the ROIC and the PDA. 360 degrees.
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    US201361815192P| true| 2013-04-23|2013-04-23|
    US61/815192|2013-04-23|
    US14/198,923|US20140312450A1|2013-04-23|2014-03-06|Small Size, Weight, and Packaging of Image Sensors|
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